Technical specifications
Features
- Direct Plasma, Low RF
- Full & single surface deposition or etching
- Gas Cabinet for up to 13 gas distribution
- Gas panel with up to 9 MCF gas loops
- Thin wafer compliant
- Desne layer, good wet chemical resistance
- Super deposition uniformity
- Automatic chamber loading
- Optional wafer transfer system integration
Robotic integration
Compatibility with Automation & Robotics : with ECM Robotics
Effective dimensions
- Up to 200 mm (Round wafer)
- Up to 166*166 mm (Square wafer)
- Alternative graphite plates for smaller samples
Options
- Modular and flexible design and tiny footprint
- 1 to 4 independent or siamese process chamber
- Configurable for 25/50 or 50/100
Industry
- Medical
- Aerospace
- Semiconductor
- Microelectronics
- optoelectronic
- Fiber optic
Material
- GaN
- SiC
- Metal
- III-V
- II-VI
- Superconductors
- Silicon