Dry etching, or plasma etching, is an etching process that utilizes free radicals produced by plasma and particularly useful for materials and semiconductors which are chemically resistant and could not be wet etched.
ECM Lab Solutions offers Tubestar and Memslab furnaces for Dry etching application in the laboratories as well as R&D centers.
Dry etching refers to the anisotropic removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface.
Opposite to wet texturing methods, plasma processes feature less dangerous handling, easier waste disposal, reduced use of reactants, consumables and water, and single-sided etching permitting new rear side concepts.
ECM Lab Solutions offers furnaces for various semiconductor applications such as :
A Batch Type Tube furnace for RTP and deposition processes.
Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.
PECVD Furnace for high quality thin film deposition.
Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.
