Rapid Thermal Processing (RTP) consists in using lamp furnaces for rapid heat treatments on silicon wafers.
RTP is a semiconductor manufacturing process which provides a way to rapidly heat samples to high temperatures to perform short processes on a timescale of a few minutes maximum.
ECM Lab Solutions offers RTP furnace for this application.
Fast heating and cooling to process temperatures up to 1400°C with ramp rates typically higher than 200°C/sec, combined with excellent gas ambient control, are within one processing recipe.
This system used to activate or dope the electronic layers by a very fast temperature raise up to 1200°C for proposed in complement of thin layers measurement systems.
Such rapid heating rates are performed by high intensity lamps (e.g. near-infrared light sources – Tungsten-halogen lamps) controlled by pyrometer and thermocouples that measure the sample temperature.
ECM Lab Solutions offers furnaces for various semiconductor applications such as :
RTP furnace for laboratory and R&D applications.
Processes : RTP, RTA, RTO, RTN, Crystallization, Densification.
RTP furnace for laboratory and production.
Processes : RTP, RTA, RTO, RTN, Crystallization, Densification, Selenization, Carbonization.
Standalone RTP furnace with multi-zone control system.
Processes : RTP, RTA, RTO, RTN, Crystallization, Densification, Selenization, Carbonization, RTCVD.
RTA system for universities and R&D applications.
Processes : RTP, RTA, RTO, RTN, Crystallization, Densification, Selenization, Carbonization.
RTA system for R&D and small scale production.
Processes : RTP, RTA, RTO, RTN, Crystallization, Densification, Selenization, Carbonization.
RTP system for the processing of silicon and compound semiconductor wafers.
Processes : RTA, Selenization, Sulfurization, RTO, Diffusion, Contact annealing, Crystallization, Densification.
