Features
Temperature range
RT to 1250°C with ramp rate up to 200°C/s
Process
Atmospheric and high-vacuum (10-6 mbar)
Effective dimensions
Up to 300 mm diameter
Options
- Cold-wall chamber, Designed for excellent process performance
- MFC-controlled gas lines, For solid, liquid and gaseous precursors
- Loadlock, And process chamber fully configurable
Integration
Possibility of Robotization and Compatibility with Automation
APPLICATION
Rapid thermal processing (RTP)
RTA
RTO
RTN
Crystallization
Densification
Selenization
Carbonization
RTCVD processes
INDUSTRY
SEMI
Optoelectronic
Microelectronics
MEMS
PV
MATERIAL
Silicon
Steel
Glass
III-V
II-VI