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AS-Premium : rapid thermal processing system

RTP system for the processing of silicon and compound semiconductor wafers.

The Annealsys AS-Premium RTP system is dedicated to the processing of silicon and compound semiconductor wafers up to 150 mm diameter or square. This machine is perfectly adapted either for R&D applications or as for production. It performs to a temperature up to 1300°C and can support several atmospheric or vacuum processes.

The AS-Premium is also a flexible system thanks to its multiconfiguration capabilities. It can be loaded manually or by a cassette to cassette robot. In addition, it is equiped with a square process chamber that makes it suitable for the processing of photovoltaic substrates up to 6 inch by 6 inch.

Features

Process Chamber

Stainless steel cold wall chamber technology

RTP heating system

Crossed-lamp IR Technology

Temperature range

Standard version : 1100°C

Option up to 1200°C

Temperature uniformity (typical)

±1°C

Ramp rate

1°C/s to 250°C/s on 2-inch substrates

Temperature control

TCs & digital PID

Cooling rate

Up to 100°C/s

Process

Atmosphere to 10-6 Torr

Substrate size

Up to 150 mm diameter wafers or 6-inch by 6-inch square
Small substrates using susceptors

Options

  • Graphite and silicon carbide coated susceptor
  • Rough vacuum pump & turbo pump
 
  • Automatic pressure control with throttle valve
 
  • Fast cooling system, Selenization kits

Integration

Compatibility with Automation & Robotics

APPLICATION

Rapid thermal annealing (RTA)
Selenization & Sulfurization
Rapid Thermal Oxidation (RTO)
Diffusion
Ohmic contact annealing
Crystallization & Densification


INDUSTRY

SEMI
Optoelectronic
Microelectronics
MEMS
PV

 

MATERIAL

Silicon
Steel
Glass
III-V
II-VI

 

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46 rue Vaujany – Technisud
38029 Grenoble cedex 2 France
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RTP furnace

Rapid thermal processing system

The AS-Premium is a multi-configuration RTP system for the processing of silicon and compound semiconductor wafers.