Diffusion
in semiconductors

What is diffusion in wafer process ?

Diffusion is a high-temperature process typically used to electrically activate impurities introduced by ion implantation and also drive dopants deeper into a film layer. 

ECM Lab Solutions offers Tubestar Furnace for Diffusion application.

Reduced pressure operating conditions in the tubes prevent over-saturation of the doping sources, and results in a more homogeneous flow distribution, which saves process gas and produces better quality electronic devices.

Performing diffusion in a batch reactor enables to accurately control temperature and ambient conditions, simultaneously, for a large number of wafers, thus increasing productivity. 

Discover tubestar furnace for diffusion

ECM Lab Solutions offers furnaces for various semiconductor applications such as : 

Tubestar furnace

Tubestar : Batch Type Horizontal Furnace

A Batch Type Tube furnace for RTP and deposition processes.

Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.

See more details on this furnace