Diffusion is a high-temperature process typically used to electrically activate impurities introduced by ion implantation and also drive dopants deeper into a film layer.
ECM Lab Solutions offers Tubestar Furnace for Diffusion application.
Reduced pressure operating conditions in the tubes prevent over-saturation of the doping sources, and results in a more homogeneous flow distribution, which saves process gas and produces better quality electronic devices.
Performing diffusion in a batch reactor enables to accurately control temperature and ambient conditions, simultaneously, for a large number of wafers, thus increasing productivity.
ECM Lab Solutions offers furnaces for various semiconductor applications such as :
A Batch Type Tube furnace for RTP and deposition processes.
Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.
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