Low Pressure Chemical Vapor Deposition (LPCVD) is a thermal process that deposits various films at low pressure for semiconductor and solar applications.
It is adapted for the deposition of a wide range of materials, for example : BSG/PSG, Low stress nitride, polysilicon.
ECM Lab Solutions offers Tubestar Furnace for LPCVD application.
ECM Lab Solutions offers furnaces for various semiconductor applications such as :
A Batch Type Tube furnace for RTP and deposition processes.
Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.