LPCVD
Low Pressure Chemical
Vapor Deposition
Tubestar furnace for
LPCVD process.
Tubestar
Batch-type horizontal
furnace
A Batch Type Tube furnace for RTP and
deposition processes.
What is LPCVD ?
There are three commonly used deposition methods: atmospheric-pressure CVD, low-pressure CVD (LPCVD), and plasma-enhanced chemical vapor deposition (PECVD, or plasma deposition).
LPCVD is a CVD process operated at subatmospheric pressures. Reduced pressures can reduce unwanted gas-phase reactions and improve film uniformity across the wafer. However, it suffers from low deposition rates. In a hot-wall LPCVD reactor the quartz tube is heated by a three-zone furnace, and gas is introduced at one end and pumped out at the opposite end.
The LPCVD process can vary according to the desired result or the material to be treated.
LPCVD : for which applications ?
This process is used for advanced semiconductor devices requiring precise uniformity.
It is adapted for the deposition of a wide range of materials (BSG, PSG, Low stress Nitride, Polysilicon, etc…)
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