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Semiconductor :
OXIDATION process

Working principle of oxidation process

Oxidation is the process used in semiconductor applications that form a silicon oxide layer on the wafer‘s surface to deposit oxide insulating layers.

ECM Lab Solutions offers Tubestar Furnace for Oxidation application.

Oxidation potentials can be adjusted specifically by mixtures of air with neutral gases or by tempering of reducing gases by bubblers or steam.

That way, alloy components can be oxidized selectively and certain oxidation steps of elements can be produced. 

Discover our furnace for Oxidation

ECM Lab Solutions offers furnaces for various semiconductor applications such as : 

Tubestar furnace

Tubestar : Batch Type Horizontal Furnace

A Batch Type Tube furnace for RTP and deposition processes.

Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.

See more details on this furnace