Plasma enhanced chemical vapor deposition (PECVD) is a process technology whereby the activation energy for the CVD reaction to occur is achieved not just by temperature, but also by an energetic plasma formed in an electric (DC or RF) field.
ECM Lab Solutions offers Memslab Furnace for this application.
PECVD is a well established technique for deposition of a wide variety of films (SiN, SiON, a:Si, SiC, SiCxNy).
PECVD processing gives manufacturers a high throughput capability for the increasing demands of low thermal budget applications.
ECM Lab Solutions offers furnaces for various semiconductor applications such as :
PECVD Furnace for high quality thin film deposition.
Processes : Annealing, Sintering, Diffusion, LPCVD, Oxidation, Glass-to-metal sealing.
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