RTP consists in using lamp furnaces for rapid heat treatments on silicon wafers.
RTP is a semiconductor manufacturing process which provides a way to rapidly heat samples to high temperatures to perform short processes on a timescale of a few minutes maximum.
ECM Lab Solutions offers RTP furnaces for this application.
Fast heating and cooling to process temperatures up to 1400°C with ramp rates typically higher than 200°C/sec, combined with excellent gas ambient control, are within one processing recipe.
This system used to activate or dope the electronic layers by a very fast temperature raise up to 1200°C for proposed in complement of thin layers measurement systems.
Such rapid heating rates are performed by high intensity lamps (e.g. near-infrared light sources – Tungsten-halogen lamps) controlled by pyrometer and thermocouples that measure the sample temperature.
